TGS2352 Просмотр технического описания (PDF) - TriQuint Semiconductor
Номер в каталоге
Компоненты Описание
производитель
TGS2352 Datasheet PDF : 10 Pages
| |||
TGS2352
DC – 12 GHz High Power SPDT Switch
Mechanical Information
0.175 0.300
0.919 0.984
1.651
1.474
23
4
1.475
1.275
1.031
0.826
1
0.621
0.177
76
0.0
0.376
5
0.176
0.0 0.175 0.300
0.919 1.150
Unit: millimeters
Thickness: 0.10
Die x, y size tolerance: +/- 0.050
Chip edge to bond pad dimensions are shown to center of pad
Ground is backside of die
Bond Pad
1
2, 7
3, 6
4
5
Symbol
RF In
Vc2
Vc1
RF Out1
RF Out2
Pad Size
0.100 x 0.200
0.100 x 0.100
0.100 x 0.100
0.200 x 0.100
0.200 x 0.100
Preliminary Data Sheet: Rev A 06/20/11
© 2011 TriQuint Semiconductor, Inc.
- 8 of 10 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®
Share Link: 