TGP2103(2005) Просмотр технического описания (PDF) - TriQuint Semiconductor
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TGP2103 Datasheet PDF : 9 Pages
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Advance Product Information
November 16, 2005
TGP2103
Chip Assembly & Bonding Diagram
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
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