TGP2100-EPU Просмотр технического описания (PDF) - TriQuint Semiconductor
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TGP2100-EPU Datasheet PDF : 9 Pages
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Advance Product Information
August 9, 2004
TGP2100-EPU
Chip Assembly & Bonding Diagram
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice.
TriQuint Semiconductor Texas Phone : (972)994-8465 Fax: (972)994-8504 Web: www.triquint.com
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