TGA4542 Просмотр технического описания (PDF) - TriQuint Semiconductor
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TGA4542 Datasheet PDF : 13 Pages
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TGA4542
37 - 40 GHz 1W Power Amplifier
Mechanical Information
14
13
12
11 10 9 8
1
7
2
3
4
56
Unit: millimeters
Thickness: 0.10
Die x, y size tolerance: +/- 0.050
Chip edge to bond pad dimensions are shown to center of pad
Ground is backside of die
Bond Pad Symbol
1
RF In
2, 14
Vg
3, 4, 5, 11, 12, 13 Vd
6, 10
Vd
7
RF Out
8
Vdet
9
Vref
Pad Size
0.190 x 0.090
0.090 x 0.090
0.093 x 0.090
0.093 x 0.190
0.190 x 0.090
0.090 x 0.090
0.090 x 0.090
Preliminary Data Sheet: Rev - 9/15/12
© 2012 TriQuint Semiconductor, Inc.
- 11 of 12 -
Disclaimer: Subject to change without notice
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