TGA4517 Просмотр технического описания (PDF) - TriQuint Semiconductor
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Компоненты Описание
производитель
TGA4517 Datasheet PDF : 11 Pages
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TGA4517
Mechanical Drawing
0.005 0.606 0.873 1.188 1.735 1.934 2.134
(0.125) (0.024) (0.034) (0.047) (0.068)(0.076)(0.084)
2.860
(0.113)
3.821 4.226
(0.150) (0.166)
3.900
(0.154)
23 4
5 67
8
9
1.951
1
(0.077)
10
(1.950
(0.077)
18 17 16
15 14 13
12
11
0
0
0.606 0.873 1.188 1.735 1.934 2.134
(0.024) (0.034) (0.047) (0.068)(0.076)(0.084)
2.860
(0.113)
3.821
(0.150)
4.352
(0.171)
Units: Millimeters (inches)
Thickness: 0.050 (0.002) (reference only)
Chip edge to bond pad dimensions are shown to center of bond pad
Chip size tolerance: +/- 0.051 (0.002)
RF Ground is backside of MMIC
Bond pad # 1:
Bond pad # 2, 18:
Bond pad # 3, 17:
Bond pad # 4, 16:
Bond pad # 5, 15:
Bond pad # 6, 14:
Bond pad # 7, 13:
Bond pad # 8, 12:
Bond pad # 9, 11:
Bond pad # 10:
(RF In) 0.125 x 0.200 (0.005 x 0.008)
(Vg1) 0.125 x 0.125 (0.005 x 0.005)
(Vd1) 0.125 x 0.125 (0.005 x 0.005)
(Vg2) 0.125 x 0.125 (0.005 x 0.005)
(Vd2) 0.125 x 0.125 (0.005 x 0.005)
(Vg3) 0.125 x 0.125 (0.005 x 0.005)
(Vg4) 0.125 x 0.125 (0.005 x 0.005)
(Vd3) 0.125 x 0.125 (0.005 x 0.005)
(Vd4) 0.125 x 0.125 (0.005 x 0.005)
(RF Out) 0.125 x 0.200 (0.005 x 0.008)
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
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