TGA2508-EPU Просмотр технического описания (PDF) - TriQuint Semiconductor
Номер в каталоге
Компоненты Описание
производитель
TGA2508-EPU Datasheet PDF : 10 Pages
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Advance Product Information
August 4, 2004
TGA2508-EPU
Mechanical Drawing
0.118
(0.005)
1.020
(0.040)
0.801
(0.032)
0.599
1
(0.024)
0.396
(0.016)
0.120
(0.005)
2
1.784
(0.070)
1.984
(0.078)
6
5
4
3
1.138
(0.045)
0.970
(0.038
0.738
(0.029)
0.536
(0.021)
0.333
(0.013)
0.119
(0.005)
0.145
(0.006)
1.982 2.108
(0.078) (0.083)
Units: millimeters (inches)
Thickness: 0.100 (0.004)
Chip edge to bond pad dimensions are shown to center of bond pad
Chip size tolerance: +/- 0.051 (0.002)
Bond pad #1:
Bond pad #2:
Bond pad #3:
Bond pad #4:
Bond pad #5:
Bond pad #6:
(RF In)
(Vg)
(DC GND)*
(RF Out)
(DC GND)*
(Vd)
0.098 x 0.199
0.099 x 0.099
0.098 x 0.099
0.099 x 0.198
0.098 x 0.198
0.202 x 0.098
(0.004 x 0.008)
(0.004 x 0.004)
(0.004 x 0.004)
(0.004 x 0.008)
(0.004 x 0.008)
(0.008 x 0.004)
* Note: RF GND is back side of MMIC.
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
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