TGF4124 Просмотр технического описания (PDF) - TriQuint Semiconductor

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Компоненты Описание

производитель

TGF4124

24 mm Discrete HFET

TriQuint Semiconductor 

Mechanical Drawing of TGF4124-EPU

81.0

(2.057)

76.3

(1.938)

65.3

(1.659)

48.8

(1.239)

32.2

(0.819)

15.7

(0.399)

4.7

(0.119)

0.0

Alternate gate pad

0.0

7.4

(0.187)

69.0

(1.753)

61.6

(1.565)

52.5

(1.333)

45.1

(1.145)

35.9

(0.913)

28.5

(0.725)

19.4

(0.493)

12.0

(0.305)

28.1

(0.714)

36.0

(0.914)

Alternate drain pad

Units: mils (mm)

Thickness: 4.0 (0.10)

Gate pad sizes are 4.0 x 4.0 (0.10 x 0.10)

Drain pad sizes are 4.7 x 14.5 (0.12 x 0.37)

A minimum of four gate bonds and eight drain

bonds is recommended for operation. Sources are

connected to backside metalization. Alternate gate

and drain pads are located on either end of the

FET for paralleling TGF4124-EPUs.

TriQuint Semiconductor Texas Phone: 972 994-8465 Fax 972 994-8504

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Web: www.triquint.com

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