TGC1439A Просмотр технического описания (PDF) - TriQuint Semiconductor
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TGC1439A Datasheet PDF : 5 Pages
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Advance Product Information
May 3, 2000
TGC1439A
Mechanical Characteristics
0.354
1
0.000
0.750
46
8 10
35
79
2
0.354
11
Units: millimeters
Thickness: 0.1016
Chip size tolerance: +/- 0.0508
Vcntl = -5.0 V to -2.5 V
Passive device, RF IN and RF OUT designators for reference only
Bond Pad #1
Bond Pad #2
Bond Pad #3
Bond Pad #4
Bond Pad #5
Bond Pad #6
Bond Pad #7
Bond Pad #8
Bond Pad #9
Bond Pad #10
Bond Pad #11
(RF IN)
(RF OUT)
(180º Bit ON: V= Vcntl)
(180º Bit ON: V= 0.0V)
(90º Bit ON: V= Vcntl)
(90º Bit ON: V= 0.0V)
(45º Bit ON: V= Vcntl)
(45º Bit ON: V= 0.0V)
(22.5º Bit ON: V= Vcntl)
(22.5º Bit ON: V= 0.0V)
(11.25º Bit ON: V= Vcntl)
0.100 x 0.150
0.100 x 0.150
0.100 x 0.100
0.100 x 0.100
0.100 x 0.100
0.100 x 0.100
0.100 x 0.100
0.100 x 0.100
0.100 x 0.100
0.100 x 0.100
0.100 x 0.100
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice.
TriQuint Semiconductor Texas : (972)994 8465 Fax (972)994 8504 Web: www.triquint.com
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