TGC1430G-EPU Просмотр технического описания (PDF) - TriQuint Semiconductor
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TGC1430G-EPU Datasheet PDF : 4 Pages
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Advance Product Information
June 29, 2004
TGC1430G-EPU
Recommended Assembly Drawing
RFin
RFout
Attach 2 TFNs and MMIC to carrier plate as
shown using conductive epoxy.
Bond 4 wieres as shown using minimum length.
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications subject to change without notice
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TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
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