TGA8061 Просмотр технического описания (PDF) - TriQuint Semiconductor
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TGA8061 Datasheet PDF : 7 Pages
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RECOMMENDED
ASSEMBLY DIAGRAM
Product Data Sheet
TGA8061-SCC
Close placement of external components is essential to stability.
VS1 connections: bond using three 1-mil diameter, 15 to 30-mil-length gold wires for optimum RF performance.
The 100 pF capacitor should be placed within 15-mils of the chip, and source wires to this chip should be kept
as short as possible.
RECOMMENDED
TEST
CONFIGURATION
TriQuint Semiconductor Texas Phone: (972)994 8465 Fax: (972)994 8504 Web: www.triquint.com
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