TEMT3700-GS08 Просмотр технического описания (PDF) - Vishay Semiconductors

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TEMT3700-GS08

Silicon NPN Phototransistor, RoHS Compliant

Vishay Semiconductors 

TEMT3700

Vishay Semiconductors Silicon NPN Phototransistor, RoHS Compliant

PACKAGE DIMENSIONS in millimeters

Mounting Pad Layout

1.2

area covered with

solder resist

4

1.6 (1.9)

20350

SOLDER PROFILE

300

max. 240 °C ca. 230 °C

250

10 s

948625

200

150

100

50

0

0

215 °C

max. 160 °C

max 40 s

90 s to 120 s

Lead Temperature

2 K/s to 4 K/s

Full Line: Typical

Dotted: Process Limits

50

100

150

200

250

Time (s)

Fig. 10 - Lead Tin (SnPb) Reflow Solder Profile

DRYPACK

Devices are packed in moisture barrier bags (MBB) to

prevent the products from moisture absorption during

transportation and storage. Each bag contains a desiccant.

FLOOR LIFE

Floor life (time between soldering and removing from MBB)

must not exceed the time indicated on MBB label:

Floor life: 1 year

Conditions: Tamb < 30 °C, RH < 60 %

Moisture sensitivity level 2, acc. to J-STD-020.

DRYING

In case of moisture absorption devices should be baked

before soldering. Conditions see J-STD-020 or label.

Devices taped on reel dry using recommended conditions

192 h at 40 °C (+ 5 °C), RH < 5 %.

www.vishay.com

4

For technical questions, contact: detectortechsupport@vishay.com

Document Number: 81555

Rev. 1.7, 10-Oct-08

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