TC2117-3.0DB Просмотр технического описания (PDF) - Microchip Technology
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TC2117-3.0DB Datasheet PDF : 18 Pages
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TC2117
3-Lead Plastic Small Outline Transistor (DB) (SOT-223)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
b2
E1
E
1
e
e1
α
A2
A
c
φ
β
b
A1
L
Units
INCHES
MILLIMETERS*
Pitch
Dimension Limits
e
MIN
NOM
.091 BSC
MAX
MIN
NOM
2.30 BSC
MAX
Outside lead pitch (basic)
e1
.181 BSC
4.60 BSC
Overall Height
A
–
–
.071
–
–
1.80
Standoff
A1
.001
–
.004
0.02
–
0.10
Molded Package Height
A2
.061
.063
.065
1.55
1.60
1.65
Overall Width
E
.264
.276
.287
6.70
7.00
7.30
Molded Package Width
E1
.130
.138
.146
3.30
3.50
3.70
Overall Length
Lead Thickness
D
.248
.256
.264
6.30
6.50
6.70
c
.009
.012
.014
0.23
0.30
0.35
Lead Width
b
.026
.030
.033
0.65
0.76
0.85
Tab Lead Width
b2
.114
.118
.124
2.90
3.00
3.15
Foot Length
Lead Angle
Mold Draft Angle, Top
Mold Draft Angle, Bottom
L
.035
φ
0°
α
10°
β
10°
–
–
0.90
–
–
–
10°
–
0.37
10°
–
16°
10°
–
16°
–
16°
10°
–
16°
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
JEDEC Equivalent TO-261 AA
Drawing No. C04-032
Revised 09-13-05
© 2006 Microchip Technology Inc.
DS21665C-page 11
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