TAT2814A1L Просмотр технического описания (PDF) - TriQuint Semiconductor
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TAT2814A1L Datasheet PDF : 11 Pages
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TAT2814A
DOCSIS 3.0 / Edge QAM Variable Gain Amplifier
Product Compliance Information
ESD Information
ESD Rating:
Value:
Test:
Standard:
ESD Rating:
Value:
Test:
Standard:
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
Solderability
Compatible with the latest version of J-STD-020, Lead
free solder, 260°
This part is compliant with EU 2002/95/EC RoHS
directive (Restrictions on the Use of Certain Hazardous
Substances in Electrical and Electronic Equipment).
MSL Rating
Level 3 at +260 °C convection reflow
The part is rated Moisture Sensitivity Level 3 at 260°C per JEDEC
standard IPC/JEDEC J-STD-020.
Recommended Soldering Temperature Profile
Solder paste manufacturers will recommend a "typical" solder reflow profile depending on their particular solder paste's flux
and metal composition. This typical profile entails the parameters necessary for the solder to properly melt and reflow, and
defines the thermal condition of the PCB soldering surface to be within an optimum temperature range. The recommended
typical profile is obtained by mounting a thermo couple directly to the solder surface area of the PCB, and recording the actual
local surface temperature during the reflow process.
The "oven profile" to achieve the "solder reflow profile" will be quite different. Oven profiles vary widely depending on
reflow equipment, PCB, components loaded on the PCB, and other factors such as fixturing etc.
The following solder reflow profile is for a typical SAC305 no-lead solder paste application and assumes that standard PCB
layout rules have been followed, such as solder mask to dam in molten solder during reflow to keep it from wicking away
from the solder joint.
Data Sheet: Rev D 05-03-12
© 2012 TriQuint Semiconductor, Inc.
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Disclaimer: Subject to change without noticee
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