SX1233 Просмотр технического описания (PDF) - Semtech Corporation
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SX1233 Datasheet PDF : 81 Pages
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SX1233
ADVANCED COMMUNICATIONS & SENSING
Table of contents
Section
DATASHEET
Page
5.3.2. DIO Pins Mapping in Packet Mode ........................................................................................................... 48
5.4. Continuous Mode ...........................................................................................................................................49
5.4.1. General Description................................................................................................................................... 49
5.4.2. Tx Processing............................................................................................................................................ 49
5.4.3. Rx Processing ........................................................................................................................................... 50
5.5. Packet Mode .................................................................................................................................................. 50
5.5.1. General Description................................................................................................................................... 50
5.5.2. Packet Format ........................................................................................................................................... 51
5.5.3. Tx Processing (without AES)..................................................................................................................... 53
5.5.4. Rx Processing (without AES) .................................................................................................................... 54
5.5.5. AES ........................................................................................................................................................... 54
5.5.6. Handling Large Packets ............................................................................................................................ 56
5.5.7. Packet Filtering.......................................................................................................................................... 56
5.5.8. DC-Free Data Mechanisms....................................................................................................................... 58
6. Configuration and Status Registers ....................................................................................................................... 60
6.1. General Description ....................................................................................................................................... 60
6.2. Common Configuration Registers ..................................................................................................................63
6.3. Transmitter Registers .....................................................................................................................................66
6.4. Receiver Registers .........................................................................................................................................67
6.5. IRQ and Pin Mapping Registers ....................................................................................................................69
6.6. Packet Engine Registers ................................................................................................................................71
6.7. Temperature Sensor Registers...................................................................................................................... 74
6.8. Test Registers................................................................................................................................................ 74
7. Application Information .......................................................................................................................................... 75
7.1. Crystal Resonator Specification..................................................................................................................... 75
7.2. Reset of the Chip ........................................................................................................................................... 75
7.2.1. POR........................................................................................................................................................... 75
7.2.2. Manual Reset ............................................................................................................................................76
7.3. Reference Design .......................................................................................................................................... 76
8. Packaging Information ........................................................................................................................................... 78
8.1. Package Outline Drawing .............................................................................................................................. 78
8.2. Recommended Land Pattern ......................................................................................................................... 78
8.3. Thermal Impedance .......................................................................................................................................79
8.4. Tape & Reel Specification.............................................................................................................................. 79
9. Revision History..................................................................................................................................................... 80
Rev 3.April 2010
Page 4
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