887-1 Просмотр технического описания (PDF) - BI Technologies

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производитель

887-1

20 &18 Pin DIP Thick Film Resistor Network

BI Technologies 

MECHANICAL

Lead Material

Substrate Material

Resistor Material

Copper Alloy, 60/40 Tin-Lead (Plating)

Alumina

Cermet

APPLICABLE DOCUMENTS

MIL-R-83401 — Resistor Networks, Fixed, Film, General Specifications

MIL-STD-202 — Test Methods for Electronic and Electrical Component Parts

MIL-STD-105 — Sampling Procedures and Tables for Inspection by Attributes

Approved to British Standard Specification BS9450 F0001

OUTLINE DIMENSIONS (Inch/mm)

.250

6.35

.060

1.52

Model 887

1.080

27.43

Max.

Model 888

.980

24.90

Max.

.340 ± .020

8.64 ± 0.51

.050

1.27

.015

0.38

Min.

.125

3.18

Max.

.138

3.51

Max.

.080 ± .020

2.03 ± 0.51

.018 ± .003

0.46 ± 0.08

Model 888

.800 ± .010

20.32 ± 0.25

Model 887

.900 ± .010

22.90 ± 0.25

.135 ± .030

3.43 ± 0.76

.100 ± .010

2.54 ± 0.25

Typical Spacing

Non-Accumulating

Lead Thickness: .010 ± .002

0.25 ± 0.05

Note: Unless otherwise specified, tolerances are ±

.005

0.13

4-144

Model 888, 887

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