STPS40170C
Characteristics (curves)
Figure 5. Reverse leakage current versus reverse voltage
applied (typical values, per diode)
Figure 6. Junction capacitance versus reverse voltage
applied (typical values, per diode)
1.E+05 I R (µA)
1.E+04
1.E+03
1.E+02
1.E+01
Tj = 150 °C
Tj = 125 °C
Tj = 100 °C
Tj = 75 °C
Tj = 50 °C
C(pF)
1000
100
1.E+00
Tj = 25 °C
1.E-01
VR(V)
10
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170
1
10
F = 1 MHz
VOSC = 30 mVRMS
Tj = 25 °C
VR(V)
100
1000
Figure 7. Forward voltage drop versus forward current
(per diode)
IF (A)
100.0
Tj = 125 °C
(maximum values)
10.0
Tj = 125 °C
(typical values)
Tj = 25 °C
1.0
(maximum values)
0.1
0.0 0.1
VF(V)
0.2 0.3 0.4 0.5 0.6 0.7
0.8 0.9 1.0
1.1 1.2
Figure 8. Thermal resistance junction to ambient versus
copper surface under tab
80 Rth(j-a) (°C/W)
70
60
D²PAK
Epoxy printed board FR4, copper thickness = 35 µm
50
40
30
20
10
0
0
SCu(cm²)
5
10
15
20
25
30
35
40
DS4412 - Rev 2
page 4/15