SSL1005M Просмотр технического описания (PDF) - Superworld Electronics
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SSL1005M Datasheet PDF : 7 Pages
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HIGH CURRENT POWER INDUCTORS SSL1005M SERIES
8. SOLDERING AND MOUNTING :
8-1. Recommended PC Board Pattern
G
H
G
Unit:m/m
G
H
I
2.03± 0.25 6.35± 0.25 3.05± 0.25
8-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
8-2.1 Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
8-2.2 Soldering Iron (Figure 2) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150° C.
b) 280° C tip temperature (max)
c) Never contact the ceramic with the iron tip
d) 1.0mm tip diameter (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 3 secs.
Preheating Soldering
20~40s max.
TP(260° C/10s max.)
Natural
cooling
217
200
150
60~180s
60~150s
480s max.
25
TIME(sec.)
Figure 1. Re-flow Soldering
Preheating Soldering
350
300
150
Natural
cooling
Over 1min.
Gradual
Cooling
Within 3secs.
Figure 2. Iron Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
08.04.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
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