8784 Просмотр технического описания (PDF) - TriQuint Semiconductor
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производитель
8784 Datasheet PDF : 9 Pages
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EQUIVALENT
SCHEMATIC
RECOMMENDED
ASSEMBLY DIAGRAM
RFIN
Q1
100um
Q3
150um
+VC 0V +VCC
TGL8784-SCC
RFOUT
Q2
100um
RF IRnFpuIntput
RF ORuFtpuOtutput
110500ppFF
115000ppFF
+Vc+VC
++VVCCcc
Bond using two 1.0-mil diameter, 25 to 30-mil length gold bond wires at both RF Input and RF Output for optimum perfor mance.
Close placement of exter nal components is essential.
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TriQuint Semiconductor, Inc. • Texas Facilities • (972) 995-8465 • www.triquint.com
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