MAS1017ATC1-1 Просмотр технического описания (PDF) - Micro Analog Systems Oy

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производитель

MAS1017ATC1-1

AM Receiver IC

Micro Analog Systems Oy 

DA1017.001

5 January, 2001

25'(5,1* ,1)250$7,21

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MAS1017ATC1

AM-Receiver IC

Wafer, EWS-tested wafer thickness 400 µm

MAS1017ATC1-1

AM-Receiver IC

Dice on sticky tape wafer thickness 400 µm,

sawn wafer, tape ring 6”, non

UV tape, tape not expanded

Please contact Micro Analog Systems Oy for other wafer thickness, sawn wafer delivery as well as SMD

package options.

/2&$/ ',675,%8725

0,&52 $1$/2* 6<67(06 2< &217$&76

Micro Analog Systems Oy

Kamreerintie 2, P.O. Box 51

FIN-02771 Espoo, FINLAND

http://www.mas-oy.com

Tel. (09) 80 521

Tel. Int. +358 9 80 521

Telefax +358 9 805 3213

E-mail: info@mas-oy.com

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Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or

performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits

shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no

claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and

Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or

modification.

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