SMBJ5913 Просмотр технического описания (PDF) - Micro Commercial Components
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производитель
SMBJ5913 Datasheet PDF : 2 Pages
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MCC
omponents
21201 Itasca Street Chatsworth
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SMBJ5913
THRU
SMBJ5956
Features
• Surface Mount Applications
• 3.3 thru 200 Volt Voltage Range
• Ideal For High Density, Low Profile Mounting
• Withstands Large Surge Stresses
• Available on Tape and Reel
Mechanical Data
• CASE: JEDEC DO-214AA molded Surface Mountable
• Terminals solderable per MIL-STD-750, Method 2026
• Polarity is indicated by cathode band
• Packaging: Standard 12mm Tape (see EIA 481)
• Maximum temperature for soldering: 260OC for 10 seconds
• For surface mount applications with flame retardent epoxy
Meeting UL94V-0
Maximum Ratings @ 25OC Unless Otherwise Specified
Steady State
Power
Dissipation
Operation And
Storage
Temperature
Thermal
Resistance
P(AV)
3.0W (Note:1)
TJ, TSTG
R
-55OC to
+150OC
25OC/W
NOTE:
1. Mounted on 4.0mm2 copper pads to each terminal.
Lead temperature at TL=75oC
Silicon
3.0 Watt
Zener Diode
DO-214AA
(SMBJ) (Round Lead)
H
Cathode Band
J
A
C
E
D
F
G
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.078
.116
B
.075
.089
C
.002
.008
D
-----
.02
E
.035
.055
F
.065
.091
G
.205
.224
H
.160
.180
J
.130
.155
MM
MIN
1.98
1.90
.05
-----
.90
1.65
5.21
4.06
3.30
B
MAX
2.95
2.25
.20
.51
1.40
2.32
5.69
4.57
3.94
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.090"
0.085”
0.070”
www.mccsemi.com
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