CF8224C Просмотр технического описания (PDF) - Nippon Precision Circuits
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производитель
CF8224C Datasheet PDF : 11 Pages
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PAD LAYOUT
(Unit: µm)
SM8224C
RING
TIP AGND
2
1
NPC
3 HB8224C
DT1 DT2
(2320,2730)
20 19
18 DTQ
TRQ 4
GND 5
17 S0
16 S1
OSCIN 6
OSCOUT 7
MODE 8
9
10
(0,0)
TEST DOUT
15 VDD
14 CDET
13 CR
11 12
STR DTDET
Chip size: 2.32 × 2.73mm
Chip thickness: 300 ± 30µm
PAD size: 80µm × 80µm
Chip base: VDD level
PAD NAME and DIMENSIONS
Pad number
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Pad name
AGND
TIP
RING
TRQ
GND
OSCIN
OSCOUT
MODE
TEST
DOUT
STR
DTDET
CR
CDET
VDD
S1
S0
DTQ
DT2
DT1
Pad dimensions [µm]
X
Y
731
2574
448
2574
205
2330
205
1947
205
1643
205
1235
205
789
205
398
451
155
734
155
1585
155
1817
155
2114
451
2114
684
2114
990
2114
1644
2114
1947
2114
2330
1896
2574
1613
2574
SEIKO NPC CORPORATION —2
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