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Компоненты Описание

производитель

SKRP

TACT Switch™ 4.2×3.2mm Compact High Operating Force (Surface Mount Type)

ALPS ELECTRIC CO.,LTD. 

TACT SwitchTM

Soldering Conditions

Detector

Push

Slide

Condition for Reflow

Available for Surface Mount Type.

1. Heating method: Double heating method with infrared heater.

2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA（K）or CC（T）at solder joint（s copper foil surface）. A heat resistive tape

should be used to fix thermocouple.

3. Temperature profile

Temperature (˚C )

260˚C max. 3 sec max.

Rotary

180

Encoders

150

230˚C

Power

Dual-in-line

Package Type

TACT SwitchTM

Custom-

Products

120 sec max.（ pre-heating ）

3 to 4min.

Time inside soldering equipment

Time

40s max.

Note

1. The above temperature shall be measured on the mounting surface of a PC board. There are cases where the PC

board's temperature greatly differs from that of the switch, depending on the material, size, thickness of PC boards

and others. The above-stated conditions shall also apply to switch surface temperatures.

2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is

highly recommended.

Sharp

Feeling

Soft

Feeling

Snap-in

Type

Conditions for Auto-dip

Available for Snap-in Type and Radial Type

（Except SKHJ, SKHL, SKQJ, SKQK, SKEG series）

Items

Condition

Surface

Mount Type

Radial

Type

Flux built-up

Mounting surface

should not be exposed to fluk

Ambient temperature of the soldered

Preheating temperature

surface of PC board.

100℃ max.

Preheating time

60s max.

Soldering temperature

260℃ max.

Duration of immersion

5s max.

Number of soldering

2times max.

Manual Soldering（Except SKRT Series）

Items

Condition

Soldering temperature

Duration of soldering

Capacity of soldering iron

350℃max.

3s max.

60W max.

Notes

1. Consult with us for availability of TACT SwitchTM washing.

2. Prevent flux penetration from the top side of the TACT SwitchTM.

3. Switch terminals and a PC board should not be coated with flux prior to soldering.

4. The second soldering should be done after the switch is stable with normal temperature.

5. Use the flux with a specific gravity of min 0.81.

（EC-19S-8 by TAMURA Corporation, or equivalents.）

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