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SIP12201 Просмотр технического описания (PDF) - Vishay Semiconductors

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SIP12201
Vishay
Vishay Semiconductors Vishay
SIP12201 Datasheet PDF : 12 Pages
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when a converter is switching at 500 kHz. However,
noise levels can be minimized by properly laying out
the components. Here are some general guidelines for
laying out a step-down converter with the SiP12201.
Since power traces in step down converters carry pul-
sating current, energy stored in trace inductance dur-
ing the pulse can cause high-frequency ringing with
input and output capacitors. Minimizing the length of
the power traces will minimize the parasitic inductance
in the trace. The same pulsating currents can cause
voltage drops due to the trace resistance and cause
effects such as ground bounce. Increasing the width
of the power trace, which in-creases the cross sec-
tional area, will minimize the trace resistance. In all dc-
to-dc converters the decoupling capacitors should be
placed as close as possible to the pins being decou-
pled to reduce the noise. The connections to both ter-
minals should be as short as possible with low-
inductance (wide) traces. In the SiP12201 converters,
the VIN is decoupled to PGND. It may be necessary to
decouple VDD to AGND, with the decoupling capacitor
being placed adjacent to the pin. AGND and PGND
traces should be isolated from each other and only
connected at a single node such as a "star ground".
SiP12201
Vishay Semiconductors
Document Number: 73541
S-52332–Rev. B, 07-Nov-05
www.vishay.com
11

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