Si3220/25 Si3200/02
Table 3. 3.3 V Power Supply Characteristics1 (Continued)
(VDD, VDD1 – VDD4 = 3.3 V, TA = 0 to 70 °C for K/F-Grade, –40 to 85 °C for B/G-Grade)
Parameter
Symbol
Test Condition
Min Typ Max Unit
Chipset Power
Consumption
PSLEEP
Sleep mode, RESET = 0,
VBAT = –70 V
—
8
— mW
POPEN
Open (high-impedance), VBAT = –70 V —
69
— mW
PSTBY
Active on-hook standby, VBAT = –70 V —
89
— mW
PACTIVE3
Forward/reverse active off-hook,
ABIAS = 4 mA, VBAT = –24 V
—
267
— mW
POHT
Forward/reverse OHT, OBIAS = 4 mA,
VBAT = –70 V
—
757
— mW
PRING
Ringing, VRING
VBAT = –70 V, 1
= 45
REN
vlormasd,2
—
541
— mW
Notes:
1. All specifications are for a single channel based on measurements with both channels in the same operating state.
2. See "3.14.4. Ringing Power Considerations" on page 54 for current and power consumption under other operating
conditions.
3. Power consumption does not include additional power required for dc loop feed. Total system power consumption must
include an additional (VDD + |VBAT|) x ILOOP term.
8
Rev. 1.3