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S1AL Просмотр технического описания (PDF) - Unspecified

Номер в каталоге
Компоненты Описание
производитель
S1AL Datasheet PDF : 2 Pages
1 2
S1AL thru S1ML
SURFACE MOUNT
GLASS PASSIVATED RECTIFIERS
REVERSE VOLTAGE - 50 to 1000Volts
FORWARD CURRENT - 1.0 Ampere
FEATURES
SOD-123FL
Low profile space
Ideal for automated placement
Glass passivated chip junctions
.114(2.9)
.098(2.5)
Low forward voltage drop
Low leakage current
High forward surge capability
High temperature soldering
260/10 seconds at terminals
Component in accordance to
.039(1.0)
.024(0.6)
RoHS 2002/95/1 and WEEE 2002/96/EC
MECHANICAL DATA
.047(1.2)
Case: JEDEC SOD-123FL molded plastic
.031(0.8)
body over glass passivated chip
Terminals: Solder plated, solderable per
J-STD-002B and JESD22-B102D
Polarity: Laser band denotes cathode end
Weight: 0.017gram
.010(0.25)
.002(0.05)
.043(1.1)
.020(0.5)
.154(3.9)
.004(0.1)max
.138(3.5)
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25ambient temperature unless otherwise specified.
Single phase, half wave ,60Hz, resistive or inductive load.
For capacitive load, derate current by 20%
CHARACTERISTICS
SYMBOL S1AL
MARKING S1AL
S1BL
S1BL
Maximum Recurrent Peak Reverse Voltage
VRRM
50
100
Maximum RMS Voltage
VRMS
35
70
Maximum DC Blocking Voltage
VDC
50
100
Maximum Average Forward
I(AV)
Rectified Current
@TL=100
Peak Forward Surge Current
8.3ms Single Half Sine-Wave
IFSM
Super Imposed On Rated Load (JEDEC Method)
Maximum Forward Voltage at 1.0A DC
Maximum DC Reverse Current
at Rated DC Blocking Voltage
@TA=25
@TA=125
Thermal resistance from junction to ambient (Note1)
VF
IR
RθJL
Typical Thermal Resistance
RθJA
Operating Temperature Range
TJ
Storage Temperature Range
TSTG
Note1: Mounted on FR-4 P.C.B. With 0.9x1.5 mm copper pad areas (35 μm thick)
S1DL
S1DL
200
140
200
S1GL
S1GL
400
280
400
1.0
S1JL
S1JL
600
420
600
25
1.1
5.0
50
35
150
-55 to +150
-55 to +150
S1KL
S1KL
800
560
800
S1ML
S1ML
1000
700
1000
UNIT
V
V
V
A
A
V
μA
/W
/W
~ 28 ~
REV. 1, 30-Dec-2011

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