Thick Film Chip Resistor – Low Ohmic
RL2512J Series
Test and Requirements
Test Item
Temperature
Coefficient of
Resistance(T.C.R.)
Short Time Overload
Insulation Resistance
Voltage Proof
Substrate Bending Test
Resistance to
soldering heat
Leaching
Solderability
Endurance at upper
category temperature
Rapid change of
temperature
Test Method
JIS C 5201 4.8
IEC 60115-1 4.8
JIS C 5201 4.13
IEC 60115-1 4.13
JIS C 5201 4.6
IEC 60115-1 4.6
JIS C 5201 4.7
IEC 60115-1 4.7
JIS C 5201 4.33
IEC 60115-1 4.33
JIS C 5201 4.18
IEC 60115 4.18
JIS C 5201 4.18
IEC 60115 4.18
JIS C 5201 4.17
IEC 60115-1 4.17
JIS C 5201 4.23
IEC 60115-1 2.23.2
JIS C 5201 4.19
IEC 60115-1 4.19
Damp heat with load
JIS 5201 4.24
Endurance
JIS C 5201 4.25
IEC 60115-1 4.25.1
Test Condition
-55°C~+155°C, 20°C is
the reference temperature
2.5 times RCWV or max.
overload voltage for 5 seconds
Max. overload voltage
for 1 minute
1.42 times RCWV (RMS) for 1
minute
Bending once with 5
seconds for 2 mm
260±5°C for 10 seconds
260±5°C for 60 seconds
245±5°C for 3 seconds
at +155°C for 1000 hrs
-55°C~+155°C, 5 cycles
40±2°C, 90~95% R.H. or max.
working voltage for 1000 hrs
with 1.5hrs “ON” and 0.5 hrs
“OFF”
70±2°C, or max. working
voltage for 1000 hrs with 1.5
hrs “ON” and 0.5 hrs “OFF”
Requirement
±5%
Within the specification
±2.0%
≥10G
no breakdown or flashover
±1.0%
±1.0%
no leaching
>95% coverage
±1.5%
±1.0%
±3.0%
±3.0%
Note: RCWV:Rated Continuous Working Voltage.
√ RCWV= Rated power (W) × Resistance value (R)
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Rev. D/AH 2008-06-04
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