RF3133 Просмотр технического описания (PDF) - RF Micro Devices
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RF3133 Datasheet PDF : 16 Pages
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RF3133
Thermal Pad and Via Design
The PCB land pattern has been designed with a thermal pad that matches the exposed die paddle size on the bottom of
the device.
Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern shown
has been designed to address thermal, power dissipation and electrical requirements of the device as well as accommo-
dating routing strategies.
The Via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size
on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested
that the quantity of vias be increased by a 4:1 ratio to achieve similar results.
Vias
0.203 mm to 0.330 mm
Finished Hole
0.5 mm to 1.2 mm Grid
Figure 2. Thermal Pad and Via Design (RFMD Qualification)
Stencil Design Recommendation
The stencil aperture are typically designed to match the pad size shown in the PCB Solder Mask pattern and are
reduced for an overall 20 percent reduction in pad area for each pad. This has yielded good solder joint results based on
volumes assembled during product introduction phase.
Critical parameters to consider for successful solder paste application include:
Accurate registration of the stencil to the PCB during printing.
Good release of stencil from the PCB after paste applied. This is improved with laser cut trapezoidal openings.
Proper storage and handling of solder paste based on solder paste vendor guidelines.
Frequent cleaning of the solder paste stencil to remove residual solder paste.
Stencil material recommendations: 5mil (0.127mm) thick stainless steel, laser cut stencils with trapezoidal openings to
promote easy release of solder paste.
Rev A6 050909
2-473
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