RF3133 Просмотр технического описания (PDF) - RF Micro Devices

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RF3133

QUAD-BAND GSM850/GSM/DCS/PCS POWER AMP MODULE

RF Micro Devices 

RF3133

PCB Design Requirements

PCB Surface Finish

The PCB surface finish used for RFMD’s qualification process is Electroless Nickel, immersion Gold. Typical thickness is

3μinch to 8μinch Gold over 180μinch Nickel.

PCB Land Pattern Recommendation

PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and

tested for optimized assembly at RFMD; however, it may require some modifications to address company specific

assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances.

PCB Metal Land and Solder Mask Pattern

A = 0.80 (mm) Sq. Typ.

B = 1.00 x 0.80 (mm) Typ.

Pin 1

9.00 (mm) Typ.

AA

8.30 (mm)

7.50 (mm)

A

B

8.20 (mm)

6.00 (mm)

A

4.50 (mm) Typ.

A

3.00 (mm)

A

5.30 (mm)

B

3.70 (mm)

1.50 (mm)

0.70 (mm)

0.00

A

AA

0.80 (mm)

B

A = 1.00 (mm) Sq. Typ.

B = 0.90 x 0.80 (mm) Typ.

C = 0.80 (mm) Sq. Typ.

D = 1.00 x 1.20 (mm) Typ.

E = 0.80 x 1.10 (mm) Typ.

F = 7.00 x 2.50 (mm) Typ.

Pin 1

9.00 (mm) Typ.

A A BB D

9.05 (mm) Typ.

7.50 (mm) Typ.

A

CE

6.00 (mm) Typ.

A

CE

4.50 (mm) Typ.

A

F CD

4.50 (mm)

3.00 (mm) Typ.

A

CE

1.50 (mm) Typ.

A

CE

0.00

A A BB D

0.05 (mm) Typ.

Metal Land Pattern

Figure 1. PCB Metal Land and Solder Mask Pattern (Top View)

Solder Mask Pattern

2-472

Rev A6 050909

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