PCF8564AU/5BB/1 Просмотр технического описания (PDF) - NXP Semiconductors.
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PCF8564AU/5BB/1 Datasheet PDF : 48 Pages
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NXP Semiconductors
PCF8564A
Real time clock and calendar
4. Ordering information
Table 1. Ordering information
Type number
Package
Name
PCF8564AU
bare die
PCF8564AUG
bare die
Description
wire bond die; 9 bonding pads
9 bumps
Version
PCF8564AU
PCF8564AUG
4.1 Ordering options
Table 2. Ordering options
Product type number
Sales item (12NC) Orderable part number
PCF8564AU/10AB/1
PCF8564AU/5BB/1
PCF8564AU/5GB/1
PCF8564AU/5GC/1
PCF8564AUG/12HB/1
935289478005
935289319015
935289477015
935293569015
935301011005
PCF8564AU/10AB/1,0
PCF8564AU/5BB/1,01
PCF8564AU/5GB/1,01
PCF8564AU/5GC/1,01
PCF8564AUG/12HB/1V
IC
revision
1
1
1
1
1
Delivery form
wafer, sawn, on FFC
unsawn wafer
unsawn wafer
unsawn wafer
wafer, sawn, on 8 inch metal
FFC; chips with soft bumps[1]
[1] Bump hardness, see Table 36.
5. Marking
Table 3. Marking codes
Type number
PCF8564AU
PCF8564AUG
Marking code
PC8564A-1
PC8564A-1
PCF8564A
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 26 August 2013
© NXP B.V. 2013. All rights reserved.
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