PC8523-1(2012) Просмотр технического описания (PDF) - NXP Semiconductors.
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PC8523-1 Datasheet PDF : 74 Pages
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NXP Semiconductors
PCF8523
Real-Time Clock (RTC) and calendar
4. Ordering information
Table 1. Ordering information
Type number
Package
Name
Description
Version
PCF8523T
SO8
plastic small outline package; 8 leads;
body width 3.9 mm
SOT96-1
PCF8523TK
HVSON8
plastic thermal enhanced very thin small outline
package; no leads; 8 terminals;
body 4 4 0.85 mm
SOT909-1
PCF8523TS
TSSOP14 plastic thin shrink small outline package; 14 leads; SOT402-1
body width 4.4 mm
PCF8523U
bare die 12 bumps (6-6)
PCF8523U
4.1 Ordering options
Table 2. Ordering options
Type number
IC
revision
PCF8523T/1
1
PCF8523TK/1
1
PCF8523TS/1
1
PCF8523U/12AA/1 1
Sales item
(12NC)
935293581118
935293573118
935291196112
935291196118
935293887005
[1] Bump hardness see Table 53.
Bump type
-
-
-
-
soft gold bumps[1]
Delivery form
tape and reel, 13 inch
tape and reel, 13 inch
tube
tape and reel, 13 inch
sawn wafer on Film Frame Carrier (FFC)
Table 3. PCF8523U wafer information
Type number
Wafer thickness
PCF8523U/12AA/1 200 m
5. Marking
Wafer diameter
6 inch
FFC for wafer size
8 inch
Marking of bad die
wafer mapping
Table 4. Marking codes
Type number
PCF8523T/1
PCF8523TK/1
PCF8523TS/1
PCF8523U/12AA/1
Marking code
8523T
8523
8523TS
PC8523-1
PCF8523
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 5 July 2012
© NXP B.V. 2012. All rights reserved.
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