PCF212311 Просмотр технического описания (PDF) - NXP Semiconductors.

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Компоненты Описание

производитель

PCF212311

SPI Real time clock/calendar

NXP Semiconductors. 

NXP Semiconductors

PCF2123

SPI Real time clock/calendar

4. Ordering information

Table 1. Ordering information

Type number

Package

Name

PCF2123BS/1

HVQFN16

PCF2123TS/1

TSSOP14

PCF2123U/5GA/1

PCF2123U/10AA/1

PCF2123U/12AA/1

PCF2123U/12HA/1

wire bond die

wire bond die

WLCSP12

WLCSP12

Description

plastic thermal enhanced very thin quad flat package;

no leads; 16 terminals; body 3 × 3 × 0.85 mm

plastic thin shrink small outline package; 14 leads;

body width 4.4 mm

12 bonding pads[1]

12 bonding pads[2]

wafer level chip size package; 12 bumps[3]

wafer level chip size package; 12 bumps[3]

[1] Unsawn wafer.

[2] Sawn 6 inch wafer on Film Frame Carrier (FFC) for 6 inch wafer, see Figure 37 on page 53.

[3] Sawn 6 inch wafer with gold bumps on Film Frame Carrier (FFC) for 8 inch wafer, see Figure 38 on page 53.

Version

SOT758-1

SOT402-1

PCF2123U/10

PCF2123U/10

PCF2123U/12

PCF2123U/12

5. Marking

Table 2. Marking codes

Type number

PCF2123BS/1

PCF2123TS/1

PCF2123U/5GA/1

PCF2123U/10AA/1

PCF2123U/12AA/1

PCF2123U/12HA/1

Marking code

123

PCF2123

PC2123-1

PC2123-1

PC2123-1

PC2123-1

PCF2123

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 5 — 27 April 2011

© NXP B.V. 2011. All rights reserved.

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