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PCA9512ADP(2009) Просмотр технического описания (PDF) - NXP Semiconductors.

Номер в каталоге
Компоненты Описание
производитель
PCA9512ADP
(Rev.:2009)
NXP
NXP Semiconductors. NXP
PCA9512ADP Datasheet PDF : 23 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
NXP Semiconductors
PCA9512A
Level shifting hot swappable I2C-bus and SMBus bus buffer
I ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115, and 1000 V CDM per JESD22-C101
I Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
I Packages offered: SO8, TSSOP8 (MSOP8)
3. Applications
I cPCI, VME, AdvancedTCA cards and other multipoint backplane cards that are
required to be inserted or removed from an operating system
4. Feature selection
Table 1. Feature selection chart
Feature
PCA9510A PCA9511A PCA9512A PCA9513A PCA9514A
Idle detect
yes
yes
yes
yes
yes
High-impedance SDAn, SCLn pins for VCC = 0 V
yes
yes
yes
yes
yes
Rise time accelerator circuitry on SDAn and SCLn pins -
yes
yes
yes
yes
Rise time accelerator circuitry hardware disable pin for -
-
yes
-
-
lightly loaded systems
Rise time accelerator threshold 0.8 V versus 0.6 V
-
-
-
yes
yes
improves noise margin
Ready open-drain output
yes
yes
-
yes
yes
Two VCC pins to support 5 V to 3.3 V level translation with -
-
yes
-
-
improved noise margins
1 V precharge on all SDAn and SCLn pins
in only
yes
yes
-
-
92 µA current source on SCLIN and SDAIN for PICMG -
-
-
yes
-
applications
5. Ordering information
Table 2. Ordering information
Tamb = 40 °C to +85 °C
Type number Topside
mark
Package
Name
PCA9512AD PA9512A SO8
PCA9512ADP 9512A
TSSOP8[1]
Description
Version
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1
[1] Also known as MSOP8.
Standard packing quantities and other packaging data are available at the NXP web site.
PCA9512A_4
Product data sheet
Rev. 04 — 19 August 2009
© NXP B.V. 2009. All rights reserved.
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