PC8245MTPU300D Просмотр технического описания (PDF) - Atmel Corporation

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PC8245MTPU300D

Integrated Processor Family

Atmel Corporation 

Thermal Management

Information

PC8245

This section provides thermal management information for the tape ball grid array

(TBGA) package for air-cooled applications. Depending on the application environment

and the operating frequency, heat sinks may be required to maintain junction tempera-

ture within specifications. Proper thermal control design is primarily dependent upon the

system-level design: the heat sink, airflow, and thermal interface material. To reduce the

die-junction temperature, heat sinks may be attached to the package by several meth-

ods: adhesive, spring clip to holes in the printed-circuit board or package, or mounting

clip and screw assembly; see Figure 4.

Figure 4. Package Exploded Cross-Sectional View with Several Heat Sink Options

Heat Sink

TBGA Package

Heat Sink

Clip

Adhesive

or

Thermal Interface

Material

Die

Printed-Circuit Board Option

Figure 5 depicts the die junction-to-ambient thermal resistance for four typical cases:

• A heat sink is not attached to the TBGA package and there exists a high board-level

thermal loading from adjacent components.

• A heat sink is not attached to the TBGA package and there exists a low board-level

thermal loading from adjacent components.

• A heat sink (for example, ChipCoolers #HTS255-P) is attached to the TBGA

package and there exists high board-level thermal loading from adjacent

components.

• A heat sink (for example, ChipCoolers #HTS255-P) is attached to the TBGA

package and there exists low board-level thermal loading from adjacent

components.

15

2171D–HIREL–06/04

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