NIS5132MN2TXG Просмотр технического описания (PDF) - ON Semiconductor

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NIS5132MN2TXG

+12 Volt Electronic Fuse

ON Semiconductor 

NIS5132

Table 1. FUNCTIONAL PIN DESCRIPTION

Pin

Function

Description

1

Ground

Negative input voltage to the device. This is used as the internal reference for the IC.

2

dv/dt

The internal dv/dt circuit controls the slew rate of the output voltage at turn on. It has an internal

capacitor that allows it to ramp up over a period of 2 ms. An external capacitor can be added to

this pin to increase the ramp time. If an additional time delay is not required, this pin should be left

open.

3

Enable/Fault The enable/fault pin is a tri−state, bidirectional interface. It can be used to enable or disable the

output of the device by pulling it to ground using an open drain or open collector device. If a

thermal fault occurs, the voltage on this pin will go to an intermediate state to signal a monitoring

circuit that the device is in thermal shutdown. It can also be connected to another device in this

family to cause a simultaneous shutdown during thermal events.

4

ILimit

A resistor between this pin and the source pin sets the overload and short circuit current limit

levels.

6−10

Source

This pin is the source of the internal power FET and the output terminal of the fuse.

11 (belly pad)

VCC

Positive input voltage to the device.

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Input Voltage, operating, steady−state (VCC to GND, Note 1)

Transient (100 ms)

VIN

−0.6 to 18

V

−0.6 to 25

Thermal Resistance, Junction−to−Air

0.1 in2 copper (Note 2)

0.5 in2 copper (Note 2)

qJA

°C/W

227

95

Thermal Resistance, Junction−to−Lead (Pin 1)

Thermal Resistance, Junction−to−Case

Total Power Dissipation @ TA = 25°C

Derate above 25°C

qJL

qJC

Pmax

27

°C/W

20

°C/W

1.3

W

10.4

mW/°C

Operating Temperature Range (Note 3)

TJ

−40 to 150

°C

Nonoperating Temperature Range

TJ

−55 to 155

°C

Lead Temperature, Soldering (10 Sec)

TL

260

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. Negative voltage will not damage device provided that the power dissipation is limited to the rated allowable power for the package.

2. 1 oz. copper, double−sided FR4.

3. Thermal limit is set above the maximum thermal rating. It is not recommended to operate this device at temperatures greater than the

maximum ratings for extended periods of time.

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