NDS8936 Просмотр технического описания (PDF) - Fairchild Semiconductor
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NDS8936 Datasheet PDF : 10 Pages
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Typical Thermal Characteristics
2.5
Total Power for Dual Operation
2
1a
1.5
Power for Single Operation
1 1b
1c
0.5
0
4.5"x5" FR-4 Board
TA = 25o C
Still Air
0.2
0.4
0.6
0.8
1
2oz COPPER MOUNTING PAD AREA (in 2 )
Figure 12. SO-8 Dual PackageMaximum
Steady-State Power Dissipation versus
Copper Mounting Pad Area.
6
1a
5
1b
4 1c
3
4.5"x5" FR-4 Board
TA = 25 o C
Still Air
VGS = 1 0 V
2
0
0.1
0.2
0.3
0.4
0.5
2oz COPPER MOUNTING PAD AREA (in 2 )
Figure 13. Maximum Steady- State Drain
Current versus Copper Mounting Pad
Area.
50
20
10
RDS(ON) LIMIT
5
1
0.5
0.1
0.05
VGS = 1 0 V
SINGLE PULSE
R θJ A = See Note 1c
TA = 25°C
100us
1ms
10ms
100ms
1s
10s
DC
0.01
0.1 0.2
0.5
1
2
5
10
VDS , DRAIN-SOURCE VOLTAGE (V)
30 50
Figure 14. Maximum Safe Operating Area.
1
0 .5
0 .2
0 .1
0 .0 5
0 .0 2
0 .0 1
0 .0 0 5
0 .0 0 2
0 .0 0 1
0.0001
D = 0.5
0.2
0.1
0.05
0.02
0.01
Single Pulse
0 .001
0 .0 1
0 .1
1
t1 , TIME (sec)
R θJA (t) = r(t) * RθJA
R θJA = See Note 1c
P(pk)
t1
t2
TJ - TA = P * R θJA (t)
Duty Cycle, D = t 1 / t 2
10
100
300
Figure 15. Transient Thermal Response Curve.
Note: Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change
depending on the circuit board design.
NDS8936 Rev. G
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