NDS352AP Просмотр технического описания (PDF) - Fairchild Semiconductor
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NDS352AP Datasheet PDF : 6 Pages
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Typical Electrical Characteristics (continued)
3
VDS = - 5V
2.5
2
1.5
1
TJ= -55°C
25°C
125°C
0.5
0
0
-1
-2
-3
-4
-5
ID, DRAIN CURRENT (A)
Figure 13. Transconductance Variation with Drain
Current and Temperature.
20
10
5
2
1
0.5
0.1
0.05
0.01
0.1
RDS(ON) LIMIT
VGS = -4.5V
SINGLE PULSE
RθJA = See Note 1b
A TA = 25°C
1ms
10ms
100ms
1s
10s
DC
0.2
0.5 1
2
5
10 20 30 50
- VDS , DRAIN-SOURCE VOLTAGE (V)
Figure 14. Maximum Safe Operating Area.
1
0.8
0.6
1a
1b
0.4
0.2
0
0
4.5"x5" FR-4 Board
TA = 25o C
Still Air
0.1
0.2
0.3
0.4
2oz COPPER MOUNTING PAD AREA (in2 )
Figue 15. SuperSOTTM _ 3 Maximum
Steady-State Power Dissipation versus
Copper Mounting Pad Area.
1.2
1.1
1
0.9
1a
0.8
1b
0.7
0.6
0
4.5"x5" FR-4 Board
TA = 25 oC
Still Air
VGS = -4.5V
0.1
0.2
0.3
0.4
2
2oz COPPER MOUNTING PAD AREA (in )
Figure 16. Maximum Steady-State Drain
Current versus Copper Mounting Pad Area.
1
0.5
D = 0.5
0.2
0.1
0.05
0.02
0.01
0.005
0.2
0.1
0.05
0.02
0.01
Single Pulse
0.002
0.001
0.0001
0.001
0.01
0.1
1
t1, TIME (sec)
R θJA (t) = r(t) * RθJA
R θJA = See Note 1b
P(pk)
t1
t2
TJ - TA = P * RθJA (t)
Duty Cycle, D = t1 /t2
10
100
300
Figure 17. Transient Thermal Response Curve.
Note : Characterization performed using the conditions described in note 1b. Transient thermal response will
change depending on the circuit board design.
NDS352Ap Rev.C
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