NDS335 Просмотр технического описания (PDF) - Fairchild Semiconductor
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NDS335 Datasheet PDF : 6 Pages
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Typical Electrical Characteristics (continued)
12
VDS = 5.0V
10
8
6
4
TJ = -55°C
25°C
125°C
2
0
0
1
2
3
4
5
I D, DRAIN CURRENT (A)
Figure 13. Transconductance Variation with Drain
Current and Temperature.
20
10
3
RDS(ON) LIMIT
1
10m10s0us
100ms
1s
0.3
10s
0.1
VGS = 2.7V
DC
SINGLE PULSE
0.03 RθJA =See Note1b
TA = 25°C
0.01
0.1 0.2
0.5
1
2
5
10
20 30
VDS , DRAIN-SOURCE VOLTAGE (V)
Figure 14. Maximum Safe Operating Area
1
0.8
0.6
1a
1b
0.4
0.2
0
0
4.5"x5" FR-4 Board
TA = 25o C
Still Air
0.1
0.2
0.3
0.4
2oz COPPER MOUNTING PAD AREA (in2 )
Figue 15. SuperSOTTM _ 3 Maximum
Steady-State Power Dissipation versus
Mounting Pad Area.
Copper
2.4
2
1.6
1a
1b
1.2
0.8
0
4.5"x5" FR-4 Board
TA = 25 oC
Still Air
VGS = 2.7V
0.1
0.2
0.3
0.4
2
2oz COPPER MOUNTING PAD AREA (in )
Figure 16. Maximum Steady-State Drain
Current versus Copper Mounting Pad Area.
1
0.5
D = 0.5
0.2
0.1
0.05
0.02
0.01
0.005
0.2
0.1
0.05
0.02
0.01
Single Pulse
0.002
0.001
0.0001
0.001
0.01
0.1
1
t1, TIME (sec)
R θJA (t) = r(t) * RθJA
R θJA = See Note 1b
P(pk)
t1
t2
TJ - TA = P * RθJA (t)
Duty Cycle, D = t1 /t2
10
100
300
Figure 17. Transient Thermal Response Curve.
Note : Characterization performed using the conditions described in note 1b. Transient thermal
change depending on the circuit board design.
response will
NDS335 Rev.C
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