NCV87722DT50RKG Просмотр технического описания (PDF) - ON Semiconductor

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NCV87722DT50RKG

LDO Regulator - Ultra Low I q, Enable, Reset 350 mA

ON Semiconductor 

NCV8772

ABSOLUTE MAXIMUM RATINGS

Rating

Symbol

Min

Max

Unit

Input Voltage (Note 1)

DC

Vin

−0.3

Transient, t < 100 ms

−

40

V

45

Input Current

Output Voltage (Note 2)

Output Current

Enable Input Voltage

Iin

Vout

Iout

DC

VEN

Transient, t < 100 ms

−5

−0.3

−3

−0.3

−

−

mA

5.5

V

Current Limited

mA

40

V

45

Enable Input Current

IEN

−1

1

mA

DT (Reset Delay Time Select) Voltage

VDT

−0.3

5.5

V

DT (Reset Delay Time Select) Current

IDT

−1

1

mA

Reset Output Voltage

VRO

−0.3

5.5

V

Reset Output Current

IRO

−3

3

mA

Junction Temperature

TJ

−40

150

°C

Storage Temperature

TSTG

−55

150

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.

2. 5.5 V or (Vin + 0.3 V) (whichever is lower).

ESD CAPABILITY (Note 3)

Rating

Symbol

Min

Max

Unit

ESD Capability, Human Body Model

ESDHBM

−2

ESD Capability, Machine Model

ESDMM

−200

ESD Capability, Charged Device Model

ESDCDM

−1

3. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010)

ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)

ESD Charge Device Model tested per AEC−Q100−011 (EIA/JESD22−C101)

2

kV

200

V

1

kV

LEAD SOLDERING TEMPERATURE AND MSL (Note 4)

Rating

Symbol

Min

Max

Unit

Moisture Sensitivity Level

DPAK−5 MSL

1

−

D2PAK−5

1

D2PAK−7

3

Lead Temperature Soldering

TSLD

Reflow (SMD Styles Only), Pb−Free Versions

−

°C

265 peak

4. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

THERMAL CHARACTERISTICS (Note 5)

Rating

Symbol

Value

Unit

Thermal Characteristics, DPAK−5

Thermal Resistance, Junction−to−Air (Note 6)

RqJA

56

Thermal Reference, Junction−to−Case (Note 6)

RYJC

8.4

Thermal Characteristics, D2PAK−5

Thermal Resistance, Junction−to−Air (Note 6)

RqJA

53

Thermal Reference, Junction−to−Case (Note 6)

RYJC

8.4

Thermal Characteristics, D2PAK−7

Thermal Resistance, Junction−to−Air (Note 6)

RqJA

51

Thermal Reference, Junction−to−Case (Note 6)

RYJC

8.4

5. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.

6. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate.

°C/W

°C/W

°C/W

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