NCV8772
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Min
Max
Unit
Input Voltage (Note 1)
DC
Vin
Transient, t < 100 ms
−0.3
−
40
V
45
Input Current
Output Voltage (Note 2)
Output Current
Enable Input Voltage
Iin
Vout
Iout
DC
VEN
Transient, t < 100 ms
−5
−0.3
−3
−0.3
−
−
mA
5.5
V
Current Limited
mA
40
V
45
Enable Input Current
IEN
−1
1
mA
DT (Reset Delay Time Select) Voltage
VDT
−0.3
5.5
V
DT (Reset Delay Time Select) Current
IDT
−1
1
mA
Reset Output Voltage
VRO
−0.3
5.5
V
Reset Output Current
IRO
−3
3
mA
Junction Temperature
TJ
−40
150
°C
Storage Temperature
TSTG
−55
150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. 5.5 V or (Vin + 0.3 V) (whichever is lower).
ESD CAPABILITY (Note 3)
Rating
Symbol
Min
Max
Unit
ESD Capability, Human Body Model
ESDHBM
−2
ESD Capability, Machine Model
ESDMM
−200
ESD Capability, Charged Device Model
ESDCDM
−1
3. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
ESD Charge Device Model tested per AEC−Q100−011 (EIA/JESD22−C101)
2
kV
200
V
1
kV
LEAD SOLDERING TEMPERATURE AND MSL (Note 4)
Rating
Symbol
Min
Max
Unit
Moisture Sensitivity Level
DPAK−5 MSL
1
−
D2PAK−5
1
D2PAK−7
3
Lead Temperature Soldering
TSLD
Reflow (SMD Styles Only), Pb−Free Versions
−
°C
265 peak
4. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
THERMAL CHARACTERISTICS (Note 5)
Rating
Symbol
Value
Unit
Thermal Characteristics, DPAK−5
Thermal Resistance, Junction−to−Air (Note 6)
RqJA
56
Thermal Reference, Junction−to−Case (Note 6)
RYJC
8.4
Thermal Characteristics, D2PAK−5
Thermal Resistance, Junction−to−Air (Note 6)
RqJA
53
Thermal Reference, Junction−to−Case (Note 6)
RYJC
8.4
Thermal Characteristics, D2PAK−7
Thermal Resistance, Junction−to−Air (Note 6)
RqJA
51
Thermal Reference, Junction−to−Case (Note 6)
RYJC
8.4
5. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
6. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate.
°C/W
°C/W
°C/W
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