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NCV8876 Просмотр технического описания (PDF) - ON Semiconductor

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NCV8876 Datasheet PDF : 17 Pages
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NCV8876
The maximum power dissipation in the diode can be
calculated as follows:
PD + Vf (max) IOUT(max)
Where: Pd: Power dissipation in the diode [W]
Vf(max): Maximum forward voltage of the diode [V]
The 4 amp, 40 V NRVB440MFS SO8FL package
Schottky diode is a recommended device.
10. Design Notes
VOUT serves a dual purpose (feedback and IC power).
The VDRV circuit has a current pulse power draw
resulting in current flow from the output sense location
to the IC. Trace ESL will cause voltage ripple to
develop at IC pin VOUT which could affect
performance.
Use a 1 mF IC VOUT pin decoupling capacitor close
to IC in addition to the VDRV decoupling capacitor.
Classic feedback loop measurements are not possible
(VOUT pin serves a dual purpose as a feedback path
and IC power). Feedback loop computer modeling
recommended.
A step load test for stability verification is
recommended.
Compensation ground must be dedicated and connected
directly to IC ground.
Do not use vias. Use a dedicated ground trace.
ROSC programming resistor ground must be dedicated
and connected directly to IC ground
Do not use vias. Use a dedicated ground trace.
IC ground & current sense resistor ground sense point
must be located on the same side of PCB.
Vias introduce sufficient ESR/ESL voltage drop
which can degrade the accuracy of the current
feedback signal amplitude (signal bounce) and
should be avoided.
Star ground should be located at IC ground pad.
VIN
rL
L
This is the location for connecting the compensation
and current sense grounds.
The IC architecture has a leading edge ISNS blanking
circuit. In some instances, current pulse leading edge
current spike RC filter may be required.
If required, 120 pF + 750 W are a recommended
evaluation starting point.
11. Determine Feedback Loop Compensation Network
The purpose of a compensation network is to stabilize the
dynamic response of the converter. By optimizing the
compensation network, stable regulation response is
achieved for input line and load transients.
Compensator design involves the placement of poles and
zeros in the closed loop transfer function. Losses from the
boost inductor, MOSFET, current sensing and boost diode
losses also influence the gain and compensation
expressions. The OTA has an ESD protection structure
(RESD 502 W, data not provided in the datasheet) located
on the die between the OTA output and the IC package
compensation pin (VC). The information from the OTA
PWM feedback control signal (VCTRL) may differ from the
ICVC signal if R2 is of similar order of magnitude as RESD.
The compensation and gain expressions which follow take
influence from the OTA output impedance elements into
account.
TypeI compensation is not possible due to the presence
of RESD. The Figure 13 compensation network corresponds
to a TypeII network in series with RESD. The resulting
controloutput transfer function is an accurate mathematical
model of the IC in a boost converter topology. The model
does have limitations and a more accurate SPICE model
should be considered for a more detailed analysis:
The attenuating effect of large value ceramic capacitors
in parallel with output electrolytic capacitor ESR is not
considered in the equations.
The efficiency term h should be a reasonable operating
condition estimate.
Vd
VOUT
VC
R2
C2
C1
RESD
VCTRL
R0
OTA
VREF
GDRV
ISNS
R1
RLOW
Rds(on)
RGDRV
Ri
VOUT
rCf
ROUT
COUT
GND
Figure 13. NCV8876 OTA and Compensation
www.onsemi.com
11

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