NCV8570 Просмотр технического описания (PDF) - ON Semiconductor

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производитель

NCV8570

200 mA, Ultra Low Noise, High PSRR, BiCMOS RF LDO Regulator

ON Semiconductor 

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

6

1

SCALE 4:1

DFN6, 2x2.2, 0.65P

CASE 506BA−01

ISSUE A

DATE 07 JUL 2008

D

A

B

L

L

L1

PIN ONE

REFERENCE

2X

0.10 C

ÉÉÉÉÉÉ

TOP VIEW

2X

0.10 C

E

DETAIL A

ALTERNATE TERMINAL

CONSTRUCTIONS

A3

EXPOSED Cu

MOLD CMPD

ÉÉÉÉÉÉ ÉÇÉÇ A

A1

0.10 C DETAIL B

DETAIL B

ALTERNATE

CONSTRUCTIONS

7X

0.08 C

SIDE VIEW

A1

C

SEATING

PLANE

D2

DETAIL A

6X L

1

e

3

6X L1

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.20 mm FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

MILLIMETERS

DIM MIN MAX

A 0.80 1.00

A1 0.00 0.05

b 0.20 0.30

D 2.00 BSC

D2 1.10 1.30

E 2.20 BSC

E2 0.70 0.90

e 0.65 BSC

K 0.20 −−−

L 0.25 0.35

L1 0.00 0.10

GENERIC

MARKING DIAGRAM*

1

XX MG

G

XX = Specific Device Code

M = Date Code

G = Pb−Free Device

E2

K

6

4

BOTTOM VIEW

6X b

0.10 C A B

0.05 C NOTE 3

*This information is generic. Please refer

to device data sheet for actual part

marking.

Pb−Free indicator, “G” or microdot “ G”,

may or may not be present.

PACKAGE

OUTLINE

SOLDERING FOOTPRINT*

1.36

6X

0.58

0.96

2.50

1

6X

0.35

0.65

PITCH

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

DOCUMENT NUMBER:

DESCRIPTION:

98AON23023D

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

6 PIN DFN, 2.0X2.2, 0.65P

PAGE 1 OF 1

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