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NCV4290 Просмотр технического описания (PDF) - ON Semiconductor

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NCV4290 Datasheet PDF : 16 Pages
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NCV4290
Thermal Model
A discussion of thermal modeling is in the ON Semiconductor web site: http://www.onsemi.com/pub/collateral/BR1487D.PDF.
Table 1. DPAK 5Lead Thermal RC Network Models
Drain Copper Area (1 oz thick)
168 mm2
736 mm2
(SPICE Deck Format)
Cauer Network
168 mm2
736 mm2
C_C1 Junction Gnd
9.5059E06
9.5059E06
C_C2 node1
Gnd
3.7125E05
3.7125E05
C_C3 node2
Gnd
1.1233E05
1.1233E05
C_C4 node3
Gnd
6.5344E04
6.5339E04
C_C5 node4
Gnd
2.1647E02
2.1606E02
C_C6 node5
Gnd
2.1471E02
2.1361E02
C_C7 node6
Gnd
7.9135E02
7.8444E02
C_C8 node7
Gnd
2.8534E01
3.1338E01
C_C9 node8
Gnd
6.6085E01
1.5496
C_C10 node9
Gnd
8.7266E01
168 mm2
24.4877
736 mm2
R_R1 Junction node1
1.3480E01
1.3480E01
R_R2 node1 node2
3.0852E01
3.0853E01
R_R3 node2 node3
8.0674E01
8.0676E01
R_R4 node3 node4
5.8520E01
5.8528E01
R_R5 node4 node5
4.7850E01
4.8022E01
R_R6 node5 node6
1.3832
1.3916
R_R7 node6 node7
4.8520
4.8196
R_R8 node7 node8
18.0698
10.0128
R_R9 node8 node9
15.7788
31.8880
R_R10 node9
Gnd
33.5404
2.7829
Units
Ws/C
Ws/C
Ws/C
Ws/C
Ws/C
Ws/C
Ws/C
Ws/C
Ws/C
Ws/C
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
168 mm2
736 mm2
Foster Network
Tau
Tau
1.000E06
1.000E06
1.000E05
1.000E05
1.000E04
1.000E04
4.893E04
4.893E04
4.770E03
4.770E03
4.129E02
4.129E02
4.237E01
4.237E01
3.499
3.499
8.532
49.601
77.552
88.429
R’s
R’s
0.0803
0.0803
0.1736
0.1736
0.5491
0.5491
0.9733
0.9733
0.1096
0.1096
0.7361
0.7361
2.8713
2.8713
3.0988
8.1070
10.1005
14.0987
57.2455
25.5115
Units
sec
sec
sec
sec
sec
sec
sec
sec
sec
sec
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
NOTE: Bold face items represent the package without the external thermal system.
Junction R1
R2
R3
Rn
C1
C2
C3
Cn
Time constants are not simple RC products. Amplitudes
of mathematical solution are not the resistance values.
Ambient
(thermal ground)
Figure 16. Grounded Capacitor Thermal Network (“Cauer” Ladder)
Junction R1
R2
R3
Rn
C1
C2
C3
Cn
Each rung is exactly characterized by its RCproduct
time constant; amplitudes are the resistances.
Ambient
(thermal ground)
Figure 17. NonGrounded Capacitor Thermal Ladder (“Foster” Ladder)
http://onsemi.com
10

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