NCP5010(2005) Просмотр технического описания (PDF) - ON Semiconductor
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NCP5010 Datasheet PDF : 18 Pages
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NCP5010
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Power Supply Voltage (Note 2)
Over Voltage Protection
Human Body Model (HBM) ESD Rating (Note 3)
VIN
7.0
V
VOUT
24
V
ESD HBM
2000
V
Machine Model (MM) ESD Rating (Note 3)
ESD MM
200
V
Digital Input Voltage
Digital Input Current
CTRL
−0.3 < VIN < Vbat+0.3
V
1.0
mA
Power Dissipation @ TA = +85 °C (Note 6)
Thermal Resistance Junction−to−Air
8−Pin Flip−Chip Package
PD
RqJA
Internally Limited
(Note 7)
mW
°C/W
Operating Ambient Temperature Range
TA
−40 to +85
°C
Operating Junction Temperature Range
TJ
−40 to +125
°C
Storage Temperature Range
Tstg
−65 to +150
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values
(not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage
may occur and reliability may be affected.
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = 25°C.
2. According to JEDEC standard JESD22−A108B.
3. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115 for all pins.
4. Latchup Current Maximum Rating: ±100 mA per JEDEC standard: JESD78.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.
6. The thermal shutdown set to 160°C (typical) avoids irreversible damage on the device due to power dissipation.
7. For the 8−Pin Flip−Chip CSP Package, the RqJA is highly dependent on the PCB Heatsink area. For example RqJA can be to 195°C/W with
50 mm total area and also 135°C/W with 500 mm. All the bumps have the same thermal resistance and need to be connected thereby optimizing
the power dissipation.
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