NBXDDA016LN1TAG Просмотр технического описания (PDF) - ON Semiconductor
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NBXDDA016LN1TAG Datasheet PDF : 6 Pages
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NBXDDA016, NBXDDB016
OE 1
FSEL 2
6 VDD
5 CLK
GND 3
4 CLK
Figure 2. Pin Connections (Top View)
Table 1. PIN DESCRIPTION
Pin No. Symbol
I/O
1
OE
LVTTL/LVCMOS
Control Input
2
FSEL
Control Input
3
GND
Power Supply
4
CLK
CML Output
5
CLK
CML Output
6
VDD
Power Supply
Description
Output Enable Pin. When left floating pin defaults to logic HIGH and output is active.
See OE pin description Table 2.
Output Frequency Select Pin. Pin will default LOW when left open. See Output Fre-
quency Select Table 3.
Ground 0 V.
Non−Inverted Clock Output. Typically loaded with 50 W receiver termination resistor to
VTT = VDD.
Inverted Clock Output. Typically loaded with 50 W receiver termination resistor to
VTT = VDD.
Positive power supply voltage. Voltage should not exceed 3.3 V ±10%.
Table 2. OUTPUT ENABLE TRI−STATE FUNCTION
OE Pin
Output Pins
Open
Active
High Level
Active
Low Level
High Z
Table 3. OUTPUT FREQUENCY SELECT
FSEL Pin
Output Frequency (MHz)
Open
(pin will float Low)
133.33
High Level
137.93
Low Level
133.33
Table 4. ATTRIBUTES
Characteristic
Value
Input Default State Resistor
170 kW
ESD Protection
Human Body Model
Machine Model
2 kV
200 V
Meets or Exceeds JEDEC Standard EIA/JESD78 IC Latchup Test
1. For additional Moisture Sensitivity information, refer to Application Note AND8003/D.
Table 5. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Units
VDD Positive Power Supply
GND = 0 V
4.6
V
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−55 to +120
°C
Tsol
Wave Solder
See Figure 6
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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