SURS8320T3G(2017) Просмотр технического описания (PDF) - ON Semiconductor
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SURS8320T3G Datasheet PDF : 7 Pages
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SCALE 1:1
HE
E
SMC 2−LEAD
CASE 403AC
ISSUE B
D
TOP VIEW
DETAIL A
A1
c
DETAIL A
A2
A
L
SIDE VIEW
b
END VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
8.750
0.344
3.790
2X 0.149
ǒ Ǔ 2X 2.250
0.089
mm
inches
SCALE 4:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DATE 27 JUL 2017
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH. MOLD
FLASH SHALL NOT EXCEED 0.254mm PER SIDE.
4. DIMENSIONS D AND E TO BE DETERMINED AT DATUM H.
5. DIMENSION b SHALL BE MEASURED WITHIN THE AREA
DETERMINED BY DIMENSION L.
MILLIMETERS
DIM MIN
MAX
A 1.95
2.61
A1 0.05
0.20
A2 1.90
2.41
b 2.90
3.20
c
0.15
0.41
D 5.55
6.25
E 6.60
7.15
H E 7.75
8.15
L 0.75
1.60
INCHES
MIN
MAX
0.077 0.103
0.002 0.008
0.075 0.095
0.114 0.126
0.006 0.016
0.219 0.246
0.260 0.281
0.305 0.321
0.030 0.063
GENERIC
MARKING DIAGRAM*
AYWW
XXXXG
G
XXXX
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
DOCUMENT NUMBER: 98AON97675F
DESCRIPTION: SMC 2−LEAD
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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