NSBA143TF3T5G Просмотр технического описания (PDF) - ON Semiconductor

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Компоненты Описание

производитель

NSBA143TF3T5G

Digital Transistors (BRT) R1 = 4.7 kΩ, R2 = ∞ kΩ

ON Semiconductor 

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

SCALE 4:1

−X−

D

b1

3

−Y−

E

2X e

1

2

2X b

0.08 X Y

TOP VIEW

3X L

1

3X L2

BOTTOM VIEW

SOT−723

CASE 631AA−01

ISSUE D

A

HE

C

SIDE VIEW

DATE 10 AUG 2009

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM

THICKNESS OF BASE MATERIAL.

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR GATE BURRS.

MILLIMETERS

DIM MIN NOM MAX

A 0.45 0.50 0.55

b 0.15 0.21 0.27

b1 0.25 0.31 0.37

C 0.07 0.12 0.17

D 1.15 1.20 1.25

E 0.75 0.80 0.85

e

0.40 BSC

H E 1.15 1.20 1.25

L

0.29 REF

L2 0.15 0.20 0.25

GENERIC

MARKING DIAGRAM*

STYLE 1:

PIN 1. BASE

2. EMITTER

3. COLLECTOR

STYLE 2:

PIN 1. ANODE

2. N/C

3. CATHODE

STYLE 3:

PIN 1. ANODE

2. ANODE

3. CATHODE

STYLE 4:

PIN 1. CATHODE

2. CATHODE

3. ANODE

STYLE 5:

PIN 1. GATE

2. SOURCE

3. DRAIN

RECOMMENDED

SOLDERING FOOTPRINT*

2X 0.27

2X

0.40

PACKAGE

OUTLINE

XX M

1

XX

= Specific Device Code

M

= Date Code

*This information is generic. Please refer

to device data sheet for actual part

marking. Pb−Free indicator, “G”, may

or not be present.

1.50

3X 0.52

0.36

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

DOCUMENT NUMBER: 98AON12989D

DESCRIPTION: SOT−723

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1

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