DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

MSM63238-XXX Просмотр технического описания (PDF) - Oki Electric Industry

Номер в каталоге
Компоненты Описание
производитель
MSM63238-XXX Datasheet PDF : 32 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
¡ Semiconductor
PAD CONFIGURATION
Pad Layout
MSM63238
PC.2 39
PC.3 40
PB.0 41
PB.1 42
PB.2 43
PB.3 44
P1.0 45
P1.1 46
P1.2 47
P1.3 48
P2.0 49
P2.1 50
P2.2 51
P2.3 52
P3.0 53
P3.1 54
P3.2 55
P3.3 56
P8.0 57
19 XTSEL0
18 OSC1
17 OSC0
16 TST3
15 TST2
14 TST1
13 XT1
12 XT0
11 VDDR
10 SIGIN
9 BS2
8 BS1
7 P7.3
6 P7.2
5 P7.1
4 P7.0
3 P6.3
2 P6.2
1 P6.1
Y
X
Chip Size
Chip Thickness
Coordinate Origin
Pad Hole Size
Pad Size
Minimum Pad Pitch
: 4.55 mm ¥ 4.55 mm
: 350 mm (typ.)
: Chip center
: 110 mm ¥ 110 mm
: 120 mm ¥ 120 mm
: 150 mm
Note: The chip substrate voltage is VSS.
7/32

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]