MRFIC1505 Просмотр технического описания (PDF) - Freescale Semiconductor
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MRFIC1505 Datasheet PDF : 8 Pages
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9
1
T
B
B1
12
4X
0.200 AB T-U Z
A
A1
48
37
Outline Dimensions
PLASTIC PACKAGE
CASE 932-03
(LQFP-48)
ISSUE F
DETAIL Y
36
U
V
V1
25
P
AE
NO1 TEDSIM: ENSIONING AND TOLERANCING PER ASME
23 DCYOA1TN4U.T5MRMOP,L1LA9IN9GE4.ADBIMISENLOSCIOANT:EMDILALTIMBEOTTETRO. MOF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODYAT
4 DTAHTEUBMOSTT,OUM, AONFDTZHTEOPABRETDINEGTELRINMEIN. ED AT
5 DDIMATEUNMSIOPNLASNSEANB.D VTO BE DETERMINED AT
6 DSIMEAETNINSGIOPNLSAANEANADC.B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 PER SIDE. DIMENSIONS AAND B DO
INCLUDE MOLD MISMATCH AND ARE
7 DDIMETEENRSMIOINNED DATODESATNUOMTPINLACNLUEDAEB.DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
8 M0IN.3I5M0U.MSOLDER PLATE THICKNESS SHALLBE
9 E0X.A0C0T76S.HAPE OF EACH CORNER IS OPTIONAL.
AE
13
S1
24
Z
S
4X
0.200 AC T-U Z
AB
G
AD
AC
BASE METAL
NJ
F
D
0.080 M AC T-U Z
SECTION AE-AE
0.080 AC
DETAIL Y
Mð_
TOP & BOTTOM
T, U, Z
MILLIMETERS
DIM MIN MAX
A 7.000 BSC
A1 3.500 BSC
B 7.000 BSC
B1 3.500 BSC
C 1.400 1.600
D 0.170 0.270
E 1.350 1.450
F 0.170 0.230
G 0.500 BSC
H 0.050 0.150
J 0.090 0.200
K 0.500 0.700
L 0 ð_ 7 ð_
M 12 ðR_EF
N 0.090 0.160
P 0.250 BSC
R 0.150 0.250
S 9.000 BSC
S1 4.500 BSC
V 9.000 BSC
V1 4.500 BSC
W 0.200 REF
AA 1.000 REF
R
CE
H
W
DETAIL AD
L ð_
K
AA
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