MPXAZ4115AC6T1 Просмотр технического описания (PDF) - Freescale Semiconductor
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MPXAZ4115AC6T1 Datasheet PDF : 7 Pages
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FLUORO SILICONE
GEL DIE COAT
WIRE BOND
LEAD
FRAME
Freescale Semiconductor, Inc. MPXAZ4115A SERIES
ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005
+5 V
DIE
P1
STAINLESS
STEEL CAP
THERMOPLASTIC
CASE
Vout
Vs
IPS
OUTPUT
1.0 mF
0.01 mF
GND
470 pF
ABSOLUTE ELEMENT
SEALED VACUUM REFERENCE
DIE BOND
Figure 2. Cross Sectional Diagram SOP
(not to scale)
Figure 2 illustrates the absolute sensing chip in the basic
chip carrier (Case 482).
Figure 3. Recommended power supply decoupling
and output filtering.
For additional output filtering, please refer to
Application Note AN1646.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D in-
put of a microprocessor or microcontroller. Proper decoup-
ling of the power supply is recommended.
5.0
4.5 TRANSFER FUNCTION:
MAX
4.0
Vout = Vs* (.009*P-.095) ± Error
VS = 5.1 Vdc
3.5 TEMP = 0 to 85°C
TYP
3.0
2.5
2.0
1.5
MIN
1.0
0.5
0
Pressure (ref: to sealed vacuum) in kPa
Figure 4. Output versus Absolute Pressure
Figure 4 shows the sensor output signal relative to pres-
sure input. Typical minimum and maximum output curves
are shown for operation over a temperature range of 0 to
85°C using the decoupling circuit shown in Figure 3. The
output will saturate outside of the specified pressure range.
A gel die coat isolates the die surface and wire bonds
from the environment, while allowing the pressure signal
to be transmitted to the sensor diaphragm. The gel die
coat and durable polymer package provide a media resis-
tant barrier that allows the sensor to operate reliably in
high humidity conditions as well as environments contain-
ing common automotive media. Contact the factory for
more information regarding media compatibility in your
specific application.
Motorola Sensor Device Data For More Information On This Product,
3
Go to: www.freescale.com
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