MPX2050 Просмотр технического описания (PDF) - Freescale Semiconductor
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производитель
MPX2050
Freescale Semiconductor
MPX2050 Datasheet PDF : 9 Pages
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On-Chip Temperature Compensation and Calibration
Pressure
Figure 3 shows the minimum, maximum and typical output
characteristics of the MPX2050 series at 25°C. The output is
directly proportional to the differential pressure and is
essentially a straight line.
The effects of temperature on Full-Scale Span and Offset
are very small and are shown under Operating
Characteristics.
40 VS = 10 Vdc
35
TA = 25°C
MPX2050
30
P1 > P2
TYP
25
MAX
20
15
10
MIN
5
0
-5
kPa 0
PSI
12.5
25
37.5
1.8
3.6
5.4
Span
Range
(Typ)
Offset
50
(Typ)
7.25
Figure 3. Output versus Pressure Differential
Silicone
Die Coat
Wire Bond
Die
P1
Stainless Steel
Metal Cover
Epoxy
Case
Lead Frame
P2
RTV Die
Bond
Figure 4. Cross-Sectional Diagram (not to scale)
Figure 4 illustrates the differential or gauge configuration
in the basic chip carrier (Case 344). A silicone gel isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
The MPX2050 series pressure sensor operating
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
Sensors
Freescale Semiconductor
MPX2050
5
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